The flux residues may remain on circuit. They
do no need to be cleaned. Clean wet paste with
isopropanol or similar solvents
Typical (Sn63 /Pb37) Reflow Profile
If the printing interval exceeds 1 hour, remove
the paste from the stencil.
The printed solder paste remains tacky for up to
8 hours to allow device insertion The exact time
depends on environmental conditions
If the printed circuit boards will be stored for
more than 6 hours after populating and prior to
reflow. It is advisable to store the boards in a
tightly closed area. This is especially important
if the the humidity exceeds 65%. Humidity should
ideally be controlled between 45-65%.
Reflow Parameters:
For optimum results, the paste should be reflowed
at a peak temperature of 30-50°C above the liquidous
temperature of the alloy. Time above liquidous should
be maintained for 30-60 seconds. Heating should be
uniform across the substrate and components. Reflow
can be accomplished with any industry accepted process.
Packaging:
Available in 250, 500 and 100 gram jars 6 ounce and
12 ounce cartridges.
Storage:
Store in refrigeration
at 5-12°C. Avoid direct sunlight and temperatures
exceeding 35°C. Allow paste to come to room temperature
for a minimum of 2 hours prior to opening. Store syringes
and cartridges vertically with the tips down.
Safety:
When using do not eat,
drink, or smoke. Avoid contact with skin and eyes. Wear
suitable gloves and eye protection. Contains lead!
Warranty:
Material
guaranteed to meet specifications for 5 months from
date of shipment.
Lead Free
Electronic
