Flux Activity:
According to J-STD-004 L1
SIR:
Per IPC SF - 818. J-STD-004 > 1 x 10(2)
Copper Mirror:
Per IPC-SF-818, J-STD-004 Pass
Silver Chromate Test Paper:
Per - IPC-SF-818, J-STD-004 Pass

Cleaning:

The flux residues may remain on the circuit. They do not need to be cleaned.
They do not need to be cleaned.

Clean wet paste with isopropanol or similar solvents.
If the printing interval exceeds 1 hour, remove the paste from the stencil.

The printed solder paste remains tacky for up to 8 hours to allow device insertion. The exact time depends on environmental conditions.

If the printed circuit boards will be stored for more than 6 hours after populating and prior to reflow. It is advisable to store the boards in a tightly closed area. This is especially important if the humidity exceeds 65%. Humidity should ideally be controlled between 45-65%.

Reflow Parameters:

For optimum results, the paste shoul be reflowed at a peak temperature of 15-30°C above the liquidous temperature of the alloy. Time above liquidous should be maintained for about 30-60 seconds. Heating should be uniform across the substrate and components. Reflow can be accomplished with any industry accepted process in air or nitrogen.

Packaging:

Available in 250, 500 and 1000 grams jars. Also 6 ounce, 12 ounce and ProFlow™ cartridges.