BOW 851 Flux is a no-clean,
water-based, water-soluble and halide-free flux designed
for mass soldering of conventional and surface mount
PCB assemblies. The unique activator system permits
exceptional solder wetting on a wide variety of metallic
substrates.
Benefits :
Rapid wetting on virtually all types of substrates
CFC-Free
No Volatile Organic Compound's
Compatible with most solder masks and board laminates
Non-Corrosive, Non-Conductive residue
Very bright and shiny joints
Application :
BOW 851 Flux can be
applied to circuit boards by dip or spraying equipment.
For optimum solder wetting action, a top-side temperature
in the 200°-240°F range is desirable.
Physical & Chemical
Properties :
#805
Specific
Gravity
1.027
Solids Content wt. %
3.5%
Flash Point(°C)
None
pH (as is)
2.6
Halide Content
None
Acid Number(mgKOH/gm
flux)
17.00-19.00
Thinner
Distilled Water
Electomigration
Pass
Surface Insulation Resistance**
>1.00 x 108
**Per IPC Class
III Test Method
Packaging and Storage :
BOW 851 Flux is available
in 1, 5 and 55-gallon containers. Because this formulation
is water-based, it is subject to freezing. A minimum
storage temperature of 40°F recommended. Should
it become frozen, BOW 851 Flux is readily reconsituted
by stirring at room termperature.
CONSULT THE
MSDS FOR HEALTH AND SAFETY INFORMATION
Lead Free
Electronic
