BOW 670 Lead Free Solder Paste

BOW ELECTRONIC SOLDER
TECHNICAL BULLETIN
BOW #670
Lead Free Solder Paste

Description :

BOW 670 Solder Paste Series is a state-of-the-art no clean solder paste that promotes wetting and minimizes soldering defects. The BOW 670 flux system is specifically optimized for Sn/Ag/Cu alloy soldering. Extensive testing at customer locations has proven this paste to be capable of defect-free performance in the production environment. The BOW 670 exhibits minimal slump and has excellent print-after-wait performance. This formula provides superior performance on a variety of surface finishes and leaves behind a clear residue. Reflow can be accomplished in air or nitrogen.

Key Benefits:

Exceptional print to print consistency
Excellent wetting
8 hour tack and work life
Passes IPC

Physical Properties (Metal Powder):

Type 3 = -325/+500 mesh
Type 4 = -400/+500 mesh

Shape:

Spherical

Melting Range:

217°C - 219°C

Composition:

Sn96.5/Ag3/Cu0.5
Sn95.5/Ag4/Cu0.5

% Metal:

Standard 88.5% ± 1

Viscosity Range:

220 +/-30 Pa.s. Malcom 10 rpm.

Density:

7.4g/cc

Ring & Plug:

Shear Stress 42N/mm2

Cu Dissolution:

<96.5/3.5 at 288°C

Performance Properties (Typical Print Thickness):

20-25 mil pitch: 0.006" (150-200 microns)
<20 mil pitch: 0.004" (100 microns)