BOW 60 No Clean Solder Paste

BOW ELECTRONIC SOLDER
TECHNICAL BULLETIN
BOW #60
No Clean Solder Paste

Description :

BOW 60 solder paste is a ready to use homogenous mixture, consisting of fully alloyed metal powders, binders, solvents and thixotropic agents for surface mount assembly applications. This paste provides excellent wetting.
It can be reflowed in air or nitrogen and feature an ultra low odor level. The printing capabilities of these pastes are unsurpassed. The residues may be left on the board

Key Benefits:

Exceptional print to print consistency
Excellent wetting
Low odor
Passes IPC requirements for Class 3 no clean pastes per IPC-SF-818
8 hour tack and work life

Physical Properties :

Metal Powder:

Type 3 = -325/+500 mesh (25-45µm)

Shape:

Spherical

Melting Point:

Sn63Pb37 (183°C)
Sn62Pb36Ag2 (179°C)
Sn96.5/Ag3.5 (221°C)

% Metal:

Stencil Printable - 90%

Viscosity Range:

M = 600 - 800 Kcps
Brookfield RVT, TF spindle, 5 rpm at 25°C

Performance Properties:

Printing Data:

Stencil Thickness: < 200µm (8 mil)
Typically 150µm ( 6 mil)

Minimum Pitch:

20 mil = 500µm (particles 25-58µm)
16 mil = 400µm (particles 25-45µmm particles 20-38µm)

Minimum Width:
10 mil = 250µm (particles 25-58µm)

Stencil Apertures:

8 mil = 200µm (particles 25-45µm, particles 20-38µm)

Slump:

Per J-STD-005
10 min @ 25°C
10 min @ 150°C
No bridging at 0.0075 mm spacing