BOW 591 solder paste are ready to use homogenous mixtures consisting of fully alloyed metal powders, binders, and solvents for surface mount assembly applications. BOW 591 is a state of the art formulation that features robust OA activity for unparalleled solderability. The sophisticated flux activation system provides excellent wetting and minimal void formation on a variety of substrates. The flux composition is completely water-soluble so all residues are removed after cleaning in deionized water.
This unique formula is specially designed to give excellent results in Lead-Free applications. BOW 591 provides excellent wetting and void-free performance with the Sn/Ag/Cu alloy system. This paste is capable of printing .012" pitch at speeds up to 6"/second. It features long stencil life and exhibits excellent first print after wait performance

• Capable of printing .012" pitch
• Excellent wetting (Sn/Pb and Pb-free)
• 8 hour stencil life
• Resistant to hot and humid slump
• Long tack life
• High-speed print capability

Type 3 = -325/+500 mesh
Type 4 = -400/+500 mesh

Shape:

Spherical

Varies depending on alloy.

Viscosity Range:

Performance Properties:

Typical Print Thickness:

20-25 mil pitch:
0.006" - 0.008" (150 - 200 microns)
< 20 mil pitch: 0.004" (100 microns)

Minimum Pitch:
12 mil (300 microns)