Bow 590 Solder Paste

BOW ELECTRONIC SOLDER
TECHNICAL BULLETIN
BOW #590
WATER-SOLUBLE SOLDER PASTE

Description :

BOW 590 is a state-of-the-art water-soluble solder paste that features robust OA activity for unparalleled solderability. Optimized rheology and careful chemical selection result in consistent print volume and excellent print definition. A sophisticated flux activation system insures excellent wetting and minimal void formation with a variety of substrates. The flux composition is completely water soluble with good temperature resistance so that all residues are removed after cleaning in either hot or cold deionized water.

Key Benefits:

Easy cleaning
Excellent wetting
Minimal voiding
Excellent print characteristics

Physical Properties: Metal Powder
Standard Alloys
Sn63/Pb37 Sn62/Pb36/Ag2 Sn96.5/Ag3.5 Sn95/Ag5 Sn95.5/Ag4/Cu0.5 Sn10/Pb88/Ag2 Sn10/Pb90 Sn95/Sb5	Type 3, 4, 5 Type 3, 4, 5 Type 3 Type 3 Type 3 Type 3 Type 3 Type 3

Shape:

Spherical

Melting Point:

Dependent on alloy

% Metal:

Stencil Print at 90 ± 1%

Dispensable at 86 ± 1%

Viscosity Range (Brookfield RVT, TF Spindle, 5 RPM at 25°C)

H: 800 - 1000 Kcps

M: 600 - 800 Kcps

D: 300-400 Kcps

Recommended Processing Guidelines:

Dispensing: Set up dispensing equipment according to manufacturer's guideline. Always try to maximize air pressure to reduce chance of tip clogging or flux separation. Avoid excessive heat during syringe usage. If dispenser is not going to be used for an extended period of time, the syringe should be removed from the machine and cleaned.

Reflow Parameters: For optimum results the paste should be reflowed at 20-30°C above the liquidous point of the alloy. The time above liquidous should be from 20-40 seconds. The temperature ramp should be as fast as the components will withstand with no soak zone necessary. Reflow can be accomplished with any industry accepted process.

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