| Stencil Life |
12-18 hours under proper
process parameters |
| Tack Time |
18-24 hours under proper
process parameters |
| Solder
Alloys |
63Sn/37Pb; 62Sn/36Pb/2Ag;
60Sn/40Pb; 96.5Sn/3.5Ag; 95Sn/5Sb; 95Sn/5Ag; 10Sn/88Pb/2Ag;
43Sn/43Pb/14Bi, 42Sn/58Bi (Other alloys available upon
request) |
| Melting
Temperatures |
63Sn/37Pb:
183°C
62Sn/36Pb/2Ag: 179°C
60Sn/40Pb: 183-191°C
96.5Sn/3.5Ag: 221°C; 95Sn/5Sb: 235-240°C
95Sn/5Ag: 221-245°C
10Sn/88Pb/2Ag: 268-290°C
43Sn/43Pb/14Bi: 144-163°C |
| Appearance |
Homogenous dark gray
cream, no separated flux present. |
| Flux
Content (wt %) |
Printing applications
10% +/-1%
Dispensing applications 13% +/- 1%
Tested according to IPC-TM-650 2.2.20 |
| Viscosity |
Printing Applications,
T2, T2A, T3 &T4 750Kcps to 850Kcps +/-10%, Dispensing
Applications, T2, T2A 400Kcps +/-10%; T3 425Kcps +/-10%;
T4, T5 450Kcps +/-10%. Tested according to IPC-TM-650
2.4.34 and 2.4.34.2 |
| Grain
Size |
-200/+325
(T2) 75-45 microns
-270/+400 (T2A) 53-38 microns
-325/+500
(T3) 45-25 microns
-400/+500 (T4) 38-25 microns;
-500/+635
(T5) 25-20 microns.
Tested according to IPC-TM-650 2.2.14
and 2.2.14.2 |
| Particle
Sphericity |
99.5% of the powder spheres
exceed 80% roundness factor. |
| Chlorine
Content in Flux (%) |
Pass – IPC-TM-650
2.3.33, less than 2.5mg/in2 via Ion Chromatography |
| Flux Designation/Copper
Mirror |
REMO as
classified by IPC-TM-650 2.3.32 |
| Insulation
Resistance |
Greater than 1x1011 after
humidity exposure. Tested according to IPC-TM-650 2.6.3.3 |
| Reflow
Property |
The paste shall coalesce
into one button with no visible discoloration |
Lead Free
Electronic
